COMPOSITIONS FOR THE STRIPPING OF PHOTORESISTS IN THE FABRICATION OF INTEGRATED CIRCUITS

摘要

ABSTRACT COMPOSITIONS FOR THE STRIPPING OF PHOTORESISTS IN THEFABRICATION OF INTEGRATED CIRCUITSThe invention relates to a composition for use in the stripping of photoresists for the fabrication of integrated circuits.According to the invention, there is used amixture of dimethyl sulphoxide (DMSO) or N-methylpyrrolidone (NMP) and 3-methoxypropylamine (MOPA). Advantageously, a little water and a corrosion inhibitor,such as sodium, tolyltriazolate, are added to the mixture .Effective stripping is obtained.(Figure 1)