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COMPOSITIONS FOR THE STRIPPING OF PHOTORESISTS IN THE FABRICATION OF INTEGRATED CIRCUITS
COMPOSITIONS FOR THE STRIPPING OF PHOTORESISTS IN THE FABRICATION OF INTEGRATED CIRCUITS
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机译:集成电路制造中用于光致抗蚀剂剥离的组合物
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摘要
THE INVENTION RELATES TO A COMPOSITION FOR USE IN THE STRIPPING OF PHOTORESISTS FOR THE FABRICATION OF INTEGRATED CIRCUITS.ACCORDING TO THE INVENTION, THERE IS USED A MIXTURE OF DIMETHYL SULPHOXIDE (DMSO) OR N-METHYLPYRROLIDONE (NMP) AND 3-METHOXYPROPYLAMINE (MOPA). ADVANTAGEOUSLY, A LITTLE WATER AND A CORROSION INHIBITOR, SUCH AS SODIUM TOLYLTRIAZOLATE, ARE ADDED TO THE MIXTURE.
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