PRINTED CONDUCTOR SUPPORT LAYER FOR LAMINATING INTO A CHIP CARD, METHOD FOR PRODUCING A PRINTED CONDUCTOR SUPPORT LAYER AND INJECTION MOLDING TOOL FOR CARRYING OUT THE METHOD FOR PRODUCING A PRINTED CONDUCTOR SUPPORT LAYER

摘要

The invention relates to a printed conductor support layer (1) for laminating into a chip card, comprising at least one printed conductor (7), which is mounted on said printed conductor support layer (1); and connecting surfaces, which are connected to said printed conductor (2). The printed conductor support layer (1) has recesses (3) on at least one flat side in the areas provided for the printed conductor (7) and the connecting surfaces, said recesses being filled with a conductive material. In the areas that are not provided with recesses, the surface of the printed conductor support layer (1) is configured in such a way as to inhibit the adhesion of the conductive material. The invention also relates to a method for producing the inventive printed conductor support layer and to a device for carrying out the method.