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SOLDER PASTE, SOLDERING METHOD USING SAID SOLDER PASTE AND JOINTED PRODUCT PREPARED BY SAID SOLDERING METHOD

机译:焊锡膏,使用所述的焊锡膏的焊接方法以及通过所述的焊锡方法制备的接合产品

摘要

A solder paste which comprises a halogen compound as an activator in such an amount as to give a halogen ion concentration per 1 g of the flux used in the paste of 3,000 ppm or less in terms of a chlorine ion; a method for soldering using the solder paste; and a jointed product prepared by using the soldering method. The solder paste exhibits excellent storage stability.
机译:一种焊膏,其包含卤素化合物作为活化剂,其含量使得每1 g焊膏中使用的助焊剂的卤素离子浓度按氯离子计为3,000 ppm或更小;使用焊锡膏进行焊接的方法;以及通过焊接方法制备的接合产品。焊膏显示出极好的存储稳定性。

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