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Development of wettability evaluation equipment for solder paste using laser displacement method

机译：利用激光位移法开发焊膏的润湿性评估设备

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Koyama Shinji; Oya Issei; Isaka Toshihiro; Shohji Ikuo; Nishimuro Masashi; Hiramoto Kiyoshi; Miyamoto Hironaga;
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年度 2013
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正文语种 eng
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1. Development of wettability evaluation equipment for solder paste using laser displacement method [J] . KOYAMA Shinji, OYA Issei, ISAKA Toshihiro, Transactions of JWRI . 2010,第2期

机译：利用激光位移法开发焊膏的润湿性评估设备
2. Examination of improvement effect of surface modification of Cu with organic acid on solder paste wettability using a laser displacement meter [J] . KOYAMA Shinji, AOKI Yukinari, SHOHJI Ikuo Transactions of JWRI . 2010,第2期

机译：用激光位移计检验有机酸对铜的表面改性对锡膏润湿性的改善效果
3. Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance [J] . S. Mallik, M. Schmidt, R. Bauer, Soldering & Surface Mount Technology . 2010,第4期

机译：通过流变测试方法评估焊膏行为及其与印刷性能的关系
4. Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology [C] . Jiho Joo, Chanmi Lee, In-seok Kye, IEEE Electronic Components and Technology Conference . 2021

机译：使用各向异性焊膏（ASP）和激光辅助粘合（实验室）技术同时传递和粘接（Sitrab）工艺的同时传递和粘接（SitraB）工艺
5. Development of methodologies for evaluating performance of fault detection and diagnostics protocols applied to unitary air-conditioning equipment. [D] . Yuill, David P. 2014

机译：开发用于评估应用于一体式空调设备的故障检测和诊断协议性能的方法。
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Development of Wettability Evaluation Equipment for Solder Paste Using Laser Displacement Method [O] . Ikuo Shohji, Shinji Koyama, Issei Oya, 2011

机译：利用激光置换法开发焊膏润湿性评价设备

Development of wettability evaluation equipment for solder paste using laser displacement method

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