Low cost electroless plating process for single chips and wafer parts and products obtained thereof

摘要

The present invention is related to a method for electroless plating nickel/gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.