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Sige - thin film - semiconductor device having sige layer structure and method for producing
Sige - thin film - semiconductor device having sige layer structure and method for producing
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机译:Sige-具有Sige层结构的薄膜-半导体器件及其制造方法
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摘要
PURPOSE: To provide a thin film transistor having an excellent manufacturing yield and low cost and excellent performance and high reliability and its manufacturing method. ;CONSTITUTION: A glass substrate is used as a substrate 1, and polycrystalline silicone germanium is formed as a semiconductor layer 2 on the substrate 1. The semiconductor layer 2 is heat-oxidized at. 700°C or less to form a heat oxide film being a gate insulation layer 3. A gate electrode 4 is formed on the gate insulation layer 3. After an impurity element is implanted (5) with the use of the gate electrode 4 as a mask, a source region 6 and a drain region 7 are formed by activating by heat process. Thereafter, an insulation film 8, a source electrode 9 and a drain electrode 10 are formed.;COPYRIGHT: (C)1995,JPO
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