首页> 外国专利> Sige - thin film - semiconductor device having sige layer structure and method for producing

Sige - thin film - semiconductor device having sige layer structure and method for producing

机译:Sige-具有Sige层结构的薄膜-半导体器件及其制造方法

摘要

PURPOSE: To provide a thin film transistor having an excellent manufacturing yield and low cost and excellent performance and high reliability and its manufacturing method. ;CONSTITUTION: A glass substrate is used as a substrate 1, and polycrystalline silicone germanium is formed as a semiconductor layer 2 on the substrate 1. The semiconductor layer 2 is heat-oxidized at. 700°C or less to form a heat oxide film being a gate insulation layer 3. A gate electrode 4 is formed on the gate insulation layer 3. After an impurity element is implanted (5) with the use of the gate electrode 4 as a mask, a source region 6 and a drain region 7 are formed by activating by heat process. Thereafter, an insulation film 8, a source electrode 9 and a drain electrode 10 are formed.;COPYRIGHT: (C)1995,JPO
机译:目的:提供一种具有优异的制造良率,低成本,优异的性能和高可靠性的薄膜晶体管及其制造方法。 ;组成:玻璃基板被用作基板1,多晶硅锗被形成为基板1上的半导体层2。半导体层2在此被热氧化。在700℃或更低的温度下形成作为栅绝缘层3的热氧化膜。在栅绝缘层3上形成栅电极4。在使用栅电极4作为杂质注入(5)杂质元素之后。掩模中,通过热处理激活形成源区6和漏区7。此后,形成绝缘膜8,源电极9和漏电极10 。;版权所有:(C)1995,JPO

著录项

  • 公开/公告号DE69522370T2

    专利类型

  • 公开/公告日2002-04-25

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD.;

    申请/专利号DE1995622370T

  • 发明设计人 TSUTSU HIROSHI;

    申请日1995-05-23

  • 分类号H01L29/786;H01L23/532;H01L21/768;H01L29/78;H01L21/321;H01L29/51;H01L29/49;H01L21/336;

  • 国家 DE

  • 入库时间 2022-08-22 00:25:35

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号