Plasma cleaning device and plasma cleaning manner null

摘要

PROBLEM TO BE SOLVED: To provide an apparatus and method of cleaning works such as substrates with a plasma capable of cleaning off inorg. and org. contaminants of the works. ;SOLUTION: The method comprises applying a high frequency voltage to a lower electrode 7 set on a substrate 1 with a cover case 20 closed to generate a high-energy plasma in a vacuum chamber 22, whereby the plasma ions or molecules collide against the substrate 1 to etch off inorg. contaminants on the surface of the substrate 1, and applying a high frequency voltage to the lower electrode 7 with ensuring a gap between this electrode and the substrate 1 to generate a low-energy plasma in the chamber 22, whereby the plasma ions or molecules collide against the surface of the substrate 1 to volatilize org. contaminants on the surface of the substrate 1 due to the heat of their collision energy.;COPYRIGHT: (C)1998,JPO