METHOD FOR MANUFACTURING HIGH-PURITY NICKEL TARGET, AND HIGH-PURITY NICKEL TARGET

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a high-purity nickel target for magnetron sputtering which gives the film satisfactory thickness uniformity and plasma a satisfactory ignition property, even in a manufacturing process for a 300 mm wafer, and to provide a high-purity nickel target.;SOLUTION: The method for manufacturing the high-purity nickel target for magnetron sputtering with superior film thickness uniformity comprises steps of hot-forging the high-purity nickel, then cold-rolling it at a rolling reduction of 30% or higher, and further heat-treating it at 250°C or a higher temperature; and repeating the above cold-rolling and heat treatment at least twice.;COPYRIGHT: (C)2003,JPO