首页> 外国专利> NOVEL POLYIMIDE, HEAT-RESISTANT ADHESIVE COMPRISING POLYIMIDE, POLYIMIDE FILM, ADHESIVE INSULATING TAPE, AND METAL LAMINATE

NOVEL POLYIMIDE, HEAT-RESISTANT ADHESIVE COMPRISING POLYIMIDE, POLYIMIDE FILM, ADHESIVE INSULATING TAPE, AND METAL LAMINATE

机译:新型聚酰亚胺,包含聚酰亚胺的耐热胶,聚酰亚胺薄膜,胶粘绝缘带和金属层压板

摘要

PROBLEM TO BE SOLVED: To provide a polyimide which has excellent adhesiveness and excellent bonding strength in bonding at low temperatures, to provide a heat-resistant adhesive comprising this polyimide, a polyimide film, an adhesive insulating tape, and a metal laminate.;SOLUTION: There are provided the polyimide having repeating units represented by formula (1), the heat-resistant adhesive comprising this polyimide, the polyimide film, the adhesive insulating tape, and the metal laminate. In formula (1), m is 0-4; n is 3-7; Y is a tetravalent organic group; R1 is a halogen or a hydrocarbon group; and hetero atoms which bond aromatic rings together are bonded to carbon atoms at ortho or meta position to each other in at least one aromatic ring, provided that when n=3, these hetero atoms are bonded to the carbon atoms at ortho or para position to each other in all the aromatic rings.;COPYRIGHT: (C)2003,JPO
机译:解决的问题:提供一种在低温粘合中具有优异的粘合性和优异的粘合强度的聚酰亚胺,提供一种包括该聚酰亚胺,聚酰亚胺膜,粘合绝缘带和金属层压板的耐热粘合剂。 :提供具有式(1)所示的重复单元的聚酰亚胺,包含该聚酰亚胺的耐热性粘合剂,聚酰亚胺膜,粘合绝缘带以及金属层叠体。式(1)中,m为0〜4。 n为3-7; Y是四价有机基团; R 1 是卤素或烃基;结合芳环的杂原子在至少一个芳环中彼此邻位或间位与碳原子键合,但前提是当n = 3时,这些杂原子与邻位或对位碳原子键合。彼此之间在所有芳香环上。;版权所有:(C)2003,JPO

著录项

  • 公开/公告号JP2003231753A

    专利类型

  • 公开/公告日2003-08-19

    原文格式PDF

  • 申请/专利权人 MITSUI CHEMICALS INC;

    申请/专利号JP20020243952

  • 发明设计人 KODAMA YOICHI;MORI MINEHIRO;

    申请日2002-08-23

  • 分类号C08G73/10;B32B15/08;C08J5/18;C09J7/02;C09J9/00;C09J179/08;

  • 国家 JP

  • 入库时间 2022-08-22 00:19:49

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号