Laminated polyimide film with adhesive layer, laminated plate with releasing polyimide film with adhesive layer, laminated board, single layer or multilayer wiring board with release polyimide film with adhesive layer, and method of manufacturing multilayer wiring board

摘要

An insulating layer having a surface roughness suitable for a semi-additive method can be obtained without etching after the hot pressing step, and a single layer or multilayer wiring board with excellent flatness can be produced. Specifically, it is preferable that a releasing layer and an adhesive layer are provided on the surface of a polyimide film, and the adhesive layer contains a polyfunctional epoxy resin, an epoxy resin curing agent and a phenolic hydroxyl group-And a releasable polyimide film with a layer is provided.