IVH multi-layer printed circuit board laminated with polyimide films

摘要

Multi-layer circuit boards, laminated with polyimide films, possess useful performance which make not only high density easier in surface mounting, but also signal processing more adaptable for high frequency arid highspeed transmission. We have developed a new manufacturing method for the multi4ayer boards. The method has beneficial features from viewpoint of process cost, because the boards having IVH structure are able to be manufactured by putting together a single circuit board and the others in one lump. The single board is composed of copper circuit layer, insulating and adhesive polyimide layer. Using multi4ayer test circuit boards prepared by the new method, we have been evaluating resistance at IVH portion, reliability for solder reflow and so on.