MOLD-RELEASE POLYIMIDE FILM WITH ADHESIVE LAYER, LAMINATED BOARD HAVING MOLD-RELEASE POLYIMIDE FILM WITH ADHESIVE LAYER, LAMINATED BOARD, SINGLE-LAYER OR MULTILAYER WIRING BOARD HAVING MOLD-RELEASE POLYIMIDE FILM WITH ADHESIVE LAYER, AND METHOD FOR PRODUCING MULTILAYER WIRING BOARD

摘要

A material capable of producing a single-layer or multi-layer wiring board with good flatness in which etching after the hot pressing process is unnecessary, an insulating layer having a surface roughness suitable for a semi-additive method can be obtained. Specifically, it has a release layer and an adhesive layer on the surface of the polyimide film, and the adhesive layer contains a polyfunctional epoxy resin, an epoxy resin curing agent, and a phenolic hydroxyl group-containing polyamide resin. A release polyimide film with an adhesive layer is provided. .