MOLD-RELEASE POLYIMIDE FILM WITH ADHESIVE LAYER, LAMINATED BOARD HAVING MOLD-RELEASE POLYIMIDE FILM WITH ADHESIVE LAYER, LAMINATED BOARD, SINGLE-LAYER OR MULTILAYER WIRING BOARD HAVING MOLD-RELEASE POLYIMIDE FILM WITH ADHESIVE LAYER, AND METHOD FOR PRODUCING MULTILAYER WIRING BOARD

摘要

Provided is a material which obviates the need for etching after a hot pressing step and with which it is possible to obtain an insulation layer having a suitable surface roughness for a semi-additive process and to produce a single-layer or multilayer wiring board having good flatness. Specifically, the present invention provides a mold-release polyimide film with an adhesive layer, said film having, on the surface of a polyimide film, a mold-release layer and adhesive layer, wherein the adhesive layer comprises a polyfunctional epoxy resin, an epoxy resin curing agent, and a phenolic hydroxyl group-containing polyamide resin.