Land grid array or ball grid array type integrated circuit socket

摘要

A land grid array or ball grid array type integrated circuit socket including a metal basin having a bottom face and multiple side walls. An insulating board snugly inlaid in the metal basin. Multiple conductive members inlaid in the insertion holes of the insulating board, upper and lower ends of the conductive members respectively correspondingly contacting with the terminals of the integrated circuit and conductive contacts of the circuit board. An upper cover bottom face of which has a receiving section for accommodating the integrated circuit therein, the upper cover being latched on the metal basin. Clamping leaf springs mounted on one side of the upper cover for fixing the integrated circuit in the receiving section of the upper cover. The resilient section of the conductive member integrally transversely extending from the inlay section. Therefore, the resilient section has longer length and greater resilience, while having not high height.