A method of manufacturing an electronic device, in particular but not exclusively a semiconductor device, in which method a substrate (2) is placed inside a process chamber (1) and a surface (3) of the substrate (2) is subjected to a cleaning process sequence comprises the steps of: ;subjecting the surface (3) of the substrate (2) to a wet cleaning treatment, ;purging the process chamber (1) with an inert gas while keeping the surface (3) of the substrate (2) wet, ;drying the surface (3) of the substrate (2).
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