Method and arrangement for controlling image size of integrated circuits on wafers through post-exposure bake hotplate-specific dose feedback

摘要

A method and an arrangement for the processing of wafers on post-exposure bake hotplates along multiple processing paths, each of which may result in different integrated circuit images, and adjust the exposure dose based on the path through the process, so as to render the output and resultant image size of each path identical to each other and close to a target value.