Method for increasing the yield in processes of deposition of thin layers on a substrate.

摘要

Method for increasing the yield of the processes of deposition of thin layers on a substrate, comprising contacting a getter device in activated form with the working atmosphere within a process chamber when the sum of partial pressures of reactive gases in the chamber is less than about 10-3 mbar, and when not currently processing any substrate manufacturing using automated handling equipment substrates and procedures used in the manufacturing steps at least for removing the getter device processing chamber while the latter is held under vacuum at the pressure required for said process of deposition.