首页> 外国专利> COPPER ELECTROPLATING LIQUID, PRETREATMENT LIQUID FOR COPPER ELECTROPLATING AND METHOD OF COPPER ELECTROPLATING

COPPER ELECTROPLATING LIQUID, PRETREATMENT LIQUID FOR COPPER ELECTROPLATING AND METHOD OF COPPER ELECTROPLATING

机译:铜电镀液,用于铜电镀的预处理液和铜电镀方法

摘要

Copper electroplating liquid contains an azole or a silane coupling agent. Independent claims are also included for: (1) a pretreatment liquid for copper electroplating which contains an azole or a silane coupling agent; and (2) a copper electroplating method by immersing in a copper sulfate electroplating liquid containing an azole or a silane coupling agent, and copper sulfate, sulfuric acid, chlorine and additives as main components, for 1-60 (3-10) seconds.
机译:铜电镀液包含唑或硅烷偶联剂。还包括以下独立权利要求:(1)用于电镀铜的预处理液,其包含吡咯或硅烷偶联剂。 (2)电镀铜的方法,该方法是将其浸入含有唑或硅烷偶联剂,以硫酸铜,硫酸,氯和添加剂为主要成分的硫酸铜电镀液中1-60(3-10)秒。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号