COPPER ELECTROPLATING LIQUID, PRETREATMENT LIQUID FOR COPPER ELECTROPLATING AND METHOD OF COPPER ELECTROPLATING

摘要

IN FILLING FINE VIA HOLES OR TRENCHES OF THE WIRING (LSI) PATTERN FORMED ON A SEMICONDUCTOR WAFER, A COPPER ELECTROPLATING IS CARRIED OUT BY USING A COPPER ELECTROPLATING SOLUTION. CONTAINING AN AZOLE OR A SILANE COUPLING AGENT, OR A COPPER ELECTROPLATING IS CARRIED OUT. AFTER THE IMMERSION INTO A PRETREATMENT SOLUTION CONTAINING AN AZOLE OR A SILANE COUPLING AGENT.AS ILLUSTRATIVELY SHOWN ABOVE, THE ADDITION OF A COMPONENT HAVING THE ACTION TO INHIBIT THE DISSOLUTION OF COPPER AN ELECTROPLATING SOLUTION OR THE PRETREATMENT BY A SOLUTION CONTAINING A COMPONENT HAVING THE ACTION TO INHIBIT THE DISSOLUTION OF COPPER CAN INHIBIT THE DISSOLUTION OF A COPPER SEED LAYER COVERING POORLY, AND THUS CAR. PREVENT THE OCCURRENCE OF DEFECTS SUCH AS VOIDS AND SEAMS