Industrial Implementation of Environmentally Friendly Nanometal Electroplating Process for Chromium and Copper Beryllium Replacement using Low Cost Pulse Current Power Supplies.

摘要

This final report documents work completed for ESTCP Project WP-0934, Industrial Implementation of Environmentally Friendly Nanometal Electroplating Process for Chromium and Copper-Beryllium Replacement using Low Cost Pulse Current Power Supplies. Nanostructured alloys are emerging as viable alternatives to hazardous chromium plating (EHC) and copper-beryllium (Cu-Be) alloys. The fundamental process operating windows, related material properties and demonstration/validation testing for the nanostructured coatings are being addressed in various development projects (funded by SERDP and ESTCP). A key consideration that will help ensure the widespread adoption and implementation of the technology in the DoD and general industry is access to high power output, low-cost pulse plating power supplies. Traditional pulse plating power supplies allow operation in frequency ranges of 0-5,000Hz. This enables its use in nearly every type of electroplating application including precious metals in the electronics industry. For the electrodeposition of nanostructured materials, the use of 0-200Hz allows sufficient fidelity to produce a wide range of alloys. Moving from traditional silicon controlled rectification to switch mode design reduces the frequency range; however it enables significant reduction in the package size and cost of components which results in an overall reduction in unit costs. The main objective of the proposed effort was to develop 100kW and 200kW power supplies capable of producing direct current and low frequency pulse and pulse reverse current and to demonstrate functionality of nanostructured Co-based and other alloy electroplating processes developed and optimized for EHC and Cu-Be replacement.