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- MOCVD AND ANNEALING PROCESSES FOR C-AXIS ORIENTED FERROELECTRIC THIN FILMS

机译:-面向C轴的铁电薄膜的MOCVD和退火工艺

摘要

PURPOSE: Metal organic chemical vapor deposition(MOCVD) and annealing processes for a c-axis oriented ferroelectric thin film is provided to form a c-axis oriented Pb5Ge3O11(PGO) thin film having low surface roughness by performing an MOCVD process at a low temperature and an annealing process at a high temperature. CONSTITUTION: A substrate is prepared. A ferroelectric material layer is deposited by an MOCVD process in which a precursor solution having a ferroelectric material concentration of about 0.1 M/L at a vaporizer temperature of between about 140 deg.C to 200 deg.C is used. The substrate and the ferroelectric material are annealed at a temperature between about 500 deg.C to 560 deg.C for between about 30 minutes to 120 minutes.
机译:用途:提供金属有机化学气相沉积(MOCVD)和退火工艺,以通过在低温下执行MOCVD工艺来形成具有低表面粗糙度的c轴取向Pb5Ge3O11(PGO)薄膜,以用于c轴取向的铁电薄膜高温退火工艺。组成:准备好基材。通过MOCVD工艺沉积铁电材料层,其中使用在约140℃至200℃之间的蒸发器温度下具有约0.1M / L的铁电材料浓度的前体溶液。在约500℃至560℃之间的温度下将衬底和铁电材料退火约30分钟至120分钟。

著录项

  • 公开/公告号KR20030015142A

    专利类型

  • 公开/公告日2003-02-20

    原文格式PDF

  • 申请/专利权人 SHARP CORPORATION;

    申请/专利号KR20020047603

  • 发明设计人 HSU SHENGTENG;LI TINGKAI;PAN WEI;

    申请日2002-08-12

  • 分类号H01L27/105;

  • 国家 KR

  • 入库时间 2022-08-21 23:47:45

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