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MOCVD and annealing processes for C-axis oriented ferroelectric thin films

机译:C轴取向铁电薄膜的MOCVD和退火工艺

摘要

A method of fabricating a c-axis ferroelectric thin film includes preparing a substrate; depositing a layer of ferroelectric material by metal organic chemical vapor deposition, including using a precursor solution having a ferroelectric material concentration of about 0.1 M/L at a vaporizer temperature of between about 140° C. to 200° C.; and annealing the substrate and the ferroelectric material at a temperature between about 500° C. to 560° C. for between about 30 minutes to 120 minutes.
机译:一种c轴铁电薄膜的制造方法,包括:准备基板;以及准备基板。通过金属有机化学气相沉积来沉积铁电材料层,包括使用在约140℃至约140℃之间的汽化器温度下具有约0.1M / L的铁电材料浓度的前体溶液。摄氏200度C。;在约500℃的温度下对衬底和铁电材料进行退火。 C.至560°;约30分钟至120分钟。

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