method of forming cavities in a multilayer circuit board using low temperature cofired ceramic on metal a mold therefor and a multilayer circuit board manufactured thereby

摘要

PURPOSE: A method and a mold for forming cavities of a multi-layer PCB and a multi-layer PCB manufactured by the same are provided to allow for ease of mounting of chips, while achieving improved stability of signal processing. CONSTITUTION: A method comprises the first step of sequentially stacking the first green tape layer(93) and/or a metal substrate(90) on second and third green tape layers(91,92); the second step of inserting protrusions(81,82) of a mold(80) corresponding to cavities(71,72), into the cavities, and mounting the mold made of a thermoplastic resin on the second and third green tape layers; and the third step of performing an isotropic colamination, to thereby achieve improved perpendicularity at the edges of the cavities and flatness of the bottoms of the cavities.