An annular saw component for cutting off wafers from a workpiece and a method of protecting a clamping edge of an annular saw componet during the cutting off of wafers from a workpiece

摘要

There is an annular or internal-diameter saw and a method of protecting the clamping edge and of cleaning the saw blade of this annular or internal-diameter saw. The annular or internal-diameter saw has an element which partly screens the clamping edge and is arranged in the vicinity of the clamping edge and the saw blade, and has an outer material layer on the clamping edge. The outer material layer faces the element and is substantially harder than a clamping edge material lying behind it. The method is distinguished by the fact that workpiece residues thrown against the clamping edge are shattered when striking the clamping edge. This is due to the fact that an element partly screening the clamping edge is provided in the vicinity of the clamping edge and the saw blade. Also, the clamping edge is given high strength by virtue of the fact that an outer material layer on the clamping edge facing the element is produced from a material which is substantially harder than a clamping edge material lying behind it.