PURPOSE: A method for net-shaping a heat spreader for semiconductors and a housing part for optical modules without machining process is provided which is economical since it is not necessary to use composite oxides as raw material powder, or to use a separate hydrogen reduction step so as to obtain metallic composite powder. CONSTITUTION: The method for net-shaping a tungsten-copper composite material using tungsten powder coated with copper comprises the steps of electroless plating the surface of tungsten powder having an average particle size of 0.6 to 6.5 microns with copper; injection molding the mixture after mixing the copper coated tungsten powder with a polymer binder; debinding the polymer binder in the injection molded material; and sintering the debinding completed material so that it has final desired dimension, shape and mechanical strength, wherein an average particle size of the tungsten powder is 1.5 to 4.5 microns, wherein the tungsten-copper composite material comprises copper sulfate as an electroless plating solution of copper, formaldehyde as a reducing agent, EDTA and triethanolamine as an accelerator, sodium carbonate and stannate as additives, and sodium hydroxide as a pH control agent so that a solution of the tungsten-copper composite material maintains a pH of 11 to 12, and wherein the sintering step is performed on a sintering bed having a structure minimizing the contacts by point contacting or line contacting green compact.
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