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A method for exposing of polycrystalline regions on damaged or structurally degenerated oxide islands in a semiconductor substrate

机译:一种用于暴露半导体衬底中受损或结构退化的氧化物岛上的多晶区域的方法

摘要

Process for identifying offsets comprises inserting a substrate (102) coated with an epitaxial layer (101) in a testing device, etching the epitaxial layer faster than the offsets in an etching solution, uncovering oxide islands (103) during etching, forming offset markers (104) assigned to the uncovered oxide islands, localizing the offsets using a defect density device in the testing device, outputting a defect density distribution as a result of the testing process, and removing the tested substrate having a partially etched epitaxial layer from the testing device. An Independent claim is also included for a testing device for carrying out the above process comprising a substrate insertion device, an etching device, a localization device, an output device, and a removal device. Preferred Features: The etching process is carried out with an ammonia solution or with alkaline solutions such as TMAH, KOH, NaOH, choline, or ethylenediamine.
机译:识别偏移的过程包括在测试设备中插入涂覆有外延层(101)的基板(102),比蚀刻溶液中的偏移更快地蚀刻外延层,在蚀刻过程中发现氧化物岛(103),形成偏移标记( 104)分配给未覆盖的氧化物岛,在测试装置中使用缺陷密度装置定位偏移,作为测试过程的结果输出缺陷密度分布,并从测试装置中移除具有部分蚀刻的外延层的被测试基板。还包括用于执行上述过程的测试装置的独立权利要求,该测试装置包括基板插入装置,蚀刻装置,定位装置,输出装置和去除装置。优选的特征:用氨溶液或用碱性溶液如TMAH,KOH,NaOH,胆碱或乙二胺进行蚀刻工艺。

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