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Semiconductor component for semiconductor integrated circuit, includes terminal region for electrical connection formed partially within trench which is provided in semiconductor substrate

机译:用于半导体集成电路的半导体部件,包括用于电连接的端子区域,该端子区域部分地形成在设置在半导体衬底中的沟槽内

摘要

A trench (30) having wall region (32b) is formed in semiconductor substrate (20). An upper trench section (30o) is included in wall regions of trench. A contact region is formed outside and proximate to trench in the region of upper trench section. A terminal region for electrical connection is formed within the trench. A trench side region having width narrower than width of trench is included in the trench. Independent claims are also included for the following: (1) trench structure transistor; (2) trench MOSFET; (3) insulated gate bipolar transistor; and (4) field plate transistor.
机译:在半导体衬底(20)中形成具有壁区域(32b)的沟槽(30)。在沟槽的壁区域中包括上部沟槽部分(30o)。在上沟槽部分的区域中,在沟槽的外部并靠近沟槽形成接触区域。在沟槽内形成用于电连接的端子区域。具有比沟槽的宽度窄的宽度的沟槽侧区域包括在沟槽中。还包括以下方面的独立权利要求:(1)沟槽结构晶体管; (2)沟槽MOSFET; (3)绝缘栅双极晶体管; (4)场板晶体管。

著录项

  • 公开/公告号DE10153315A1

    专利类型

  • 公开/公告日2003-05-15

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE2001153315

  • 发明设计人 ZUNDEL MARKUS;HIRLER FRANZ;

    申请日2001-10-29

  • 分类号H01L29/78;H01L23/48;

  • 国家 DE

  • 入库时间 2022-08-21 23:42:33

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