Making light-emitting semiconductor chip, deposits buffer layer and adds connecting layer over it, at lower temperature

摘要

The buffer layer (2) is deposited onto the substrate (1) at a first temperature. A layer (3) forming part of the connecting semiconductor layer structure (4) is added in the direction of growth, onto the buffer layer. Layer (3) is grown at a lower temperature. An Independent claim is included for the corresponding light-emitting semiconductor chip.