Making semiconductor chips involves building up semiconductor layers, applying metal plating to epitaxial growth substrate and depositing metal layer galvanically before structuring and separating layers into individual chips

摘要

The method involves building up the semiconductor layers (2) through an epitaxial growth substrate (1), applying a metal plating (3) to the layers, depositing a metal layer (4) which can contain gold, silver or copper, galvanically onto the metal plating and then structuring and separating out the layers into individual semiconductor chips (6). Independent claim describes semiconductor component having at least one semiconductor chip made in layers and coated with a metal plating.