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A process for the preparation of a semiconductor memory device by the use of a reference frame arf - laser beam exposed photoresist - pattern

机译:通过使用参考框架arf-激光束曝光的光刻胶-图案制备半导体存储器件的方法。

摘要

A method for producing a semiconductor memory device comprises the steps of forming a mask layer on a target layer to be etched, applying a photoresist on the mask layer, exposing the photoresist by inserting a light source whose wavelength of about 157 nm to 193 nm, forming a photoresist - pattern by development of the photoresist, forming a mask pattern by selective etching of the mask layer with an etching gas, with the exception of a fluorine-based gas by insertion of the photoresist - pattern and an etching mask; and selectively etching of the target layer by insertion of the mask pattern as an etching mask composed of.
机译:一种用于制造半导体存储器件的方法,包括以下步骤:在要蚀刻的目标层上形成掩模层;在掩模层上施加光致抗蚀剂;通过插入波长约为157nm至193nm的光源来曝光光致抗蚀剂;通过光致抗蚀剂的显影形成光致抗蚀剂-图案,通过用蚀刻气体选择性蚀刻掩模层形成掩模图案,除了通过插入光致抗蚀剂-图案和蚀刻掩模形成的氟基气体之外;以及通过插入作为由蚀刻掩模组成的掩模图案来选择性地蚀刻目标层。

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