首页> 外国专利> Polishing tool for chemical-mechanical planarization process, has holder for holding polishing pad which is self rotated for polishing wafer surface mounted on vacuum chuck

Polishing tool for chemical-mechanical planarization process, has holder for holding polishing pad which is self rotated for polishing wafer surface mounted on vacuum chuck

机译：用于化学机械平面化工艺的抛光工具，具有用于保持抛光垫的支架，该支架可自动旋转以将抛光的晶片表面安装在真空吸盘上

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摘要

A holder (13) connected to a movable arm (14) has a polishing pad (12) which is self rotated to polish a wafer (11) that is mounted on a vacuum chuck (10). The polishing pad has diameter of 12-20 inches.

机译：连接至可动臂（14）的支架（13）具有抛光垫（12），该抛光垫可自转以抛光安装在真空吸盘（10）上的晶片（11）。抛光垫的直径为12-20英寸。

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公开/公告号DE10246025A1

专利类型
公开/公告日2003-05-08

原文格式PDF
申请/专利权人 PROMOS TECHNOLOGIES INC.;
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申请/专利号DE2002146025
发明设计人 ROC CHAMPION YI;
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申请日2002-10-02
分类号H01L21/302;
国家 DE
入库时间 2022-08-21 23:41:56

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