首页> 外国专利> CLOSED ACIDIC COPPER PLATING SYSTEM AND HEAT RESISTANT ACIDIC COPPER PLATING BATH UTILIZED FOR THE SAME

CLOSED ACIDIC COPPER PLATING SYSTEM AND HEAT RESISTANT ACIDIC COPPER PLATING BATH UTILIZED FOR THE SAME

机译:封闭式酸性铜镀层系统和相同用途的耐热酸性铜镀层浴

摘要

PROBLEM TO BE SOLVED: To provide a practical closed acidic copper plating system.;SOLUTION: The closed acidic copper plating system has an acidic copper plating main tank, and a recovery tank and counter-current rinsing tank disposed in succession thereto, in which the acidic copper plating liquid recovered in the recovery tank is composed to serve as a replenishing liquid for acidic copper plating after removal of impurities in an impurity removing apparatus and thickening of the liquid at need. The warmth resistant acidic copper plating liquid bath contains copper sulfate, sulfuric acid and chlorine ions as the basic composition to be advantageously used for the same and further contains a polyether compound, sulfur compound and nitrogen-containing compound as additive components. An alkylene oxide addition type amine compound is further added thereto.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种实用的封闭式酸性镀铜系统。解决方案:封闭式酸性镀铜系统具有酸性镀铜主槽,接连设置的回收槽和逆流冲洗槽。在回收罐中回收的酸性镀铜液在杂质去除装置中去除杂质并根据需要使液体增稠之后,用作酸性镀铜的补充液。耐温酸性镀铜液浴以硫酸铜,硫酸和氯离子为基本成分而优选使用,另外还含有聚醚化合物,硫化合物和含氮化合物作为添加成分。向其中进一步添加环氧烷加成型胺化合物。版权所有:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004169072A

    专利类型

  • 公开/公告日2004-06-17

    原文格式PDF

  • 申请/专利权人 EBARA UDYLITE KK;

    申请/专利号JP20020333851

  • 申请日2002-11-18

  • 分类号C25D21/18;C25D3/38;C25D21/08;C25D21/20;C25D21/22;

  • 国家 JP

  • 入库时间 2022-08-21 23:33:51

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