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MANUFACTURING METHOD FOR RESIN MOLDED PRODUCT, MANUFACTURING METHOD FOR METAL STRUCTURE FOR MOLD AND RESIN MOLDED PRODUCT

机译:树脂模制品的制造方法,模具和树脂模制品的金属结构的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a resin molded product, capable of manufacturing the resin molded product having a desired molding depth, and a manufacturing method for a metal structure for a mold used in the manufacture of the resin molded product.;SOLUTION: A plating seed layer 5a is bonded to a substrate 1 and a first resist pattern 4a is formed thereon. An Ni metal layer 6a is formed on the seed layer 5a exposed by plating treatment and a second resist pattern 4b is formed thereon. A plating seed layer 5b is bonded to the substrate to apply plating treatment to the substrate and an Ni metal layer 6b is formed on the plating seed layer 5b to complete the metal structure 6 for the mold. This metal structure 6 for the mold is used to form a resin chip by injection molding.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种能够制造具有期望的成型深度的树脂成型品的树脂成型品的制造方法,以及用于该树脂成型品的制造中的模具的金属结构的制造方法。 ;解决方案:将电镀种子层5a粘结到衬底1上,并在其上形成第一抗蚀剂图案4a。在通过电镀处理暴露的籽晶层5a上形成Ni金属层6a,并在其上形成第二抗蚀剂图案4b。将电镀种子层5b结合到基板上以对基板进行电镀处理,并且在电镀种子层5b上形成Ni金属层6b以完成用于模具的金属结构6。该模具用金属结构6用于通过注射成型形成树脂芯片。版权所有:(C)2004,JPO

著录项

  • 公开/公告号JP2004148519A

    专利类型

  • 公开/公告日2004-05-27

    原文格式PDF

  • 申请/专利权人 KURARAY CO LTD;

    申请/专利号JP20020312943

  • 发明设计人 NISHI TAIJI;YANAGAWA YUKIHIRO;

    申请日2002-10-28

  • 分类号B29C33/38;B81B1/00;B81C1/00;C12M1/00;C12N15/09;C12Q1/68;C25D5/02;C25D7/00;G01N33/53;

  • 国家 JP

  • 入库时间 2022-08-21 23:33:26

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