SHEET FOR PUNCHING PRINTED WIRING SUBSTRATE AND METHOD OF PUNCHING PRINTED WIRING SUBSTRATE USING THE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a sheet for punching a printed wiring substrate excellent in positioning accuracy in punching the substrate and in throwing power in plating and a method of punching a printed wiring substrate using the sheet.;SOLUTION: The sheet for punching a printed wiring substrate comprises arranging an aqueous tackifier layer [II] on one side of a plastic film or a metal foil [I] or arranging the aqueous tackifier layer [II] on one side of the plastic film or the metal foil [I] and further arranging at least one layer [III] consisting of the component selected from the group consisting of (A) an aqueous lubricant, (B) a water-soluble polymer, (C) a resin composition containing a copolymer having a compound shown in general formula (1) as a copolymer component and (D) a resin composition containing a water-soluble polymer and a water-soluble lubricant on the other side of the plastic film or the metal foil [I]. A method of punching a printed wiring substrate using the sheet is also presented.;COPYRIGHT: (C)2004,JPO&NCIPI