PRODUCTION PROCESS OF SUBSTRATE SHEET WITH CONDUCTIVE BUMP, SUBSTRATE SHEET WITH CONDUCTIVE BUMP, SUBSTRATE SHEET, PRODUCTION PROCESS OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a production process of a substrate sheet with conductive bump in which the number of times of a step for coating the surface of the substrate sheet with conductive paste can be decreased, and thereby the production time of the substrate sheet with conductive paste can be shortened and consumption of the conductive paste can be reduced while enhancing the yield in production of the substrate sheet with conductive paste, and to provide a production process of a multilayer printed wiring board.;SOLUTION: A planar substrate sheet 10 is prepared. A protrusion 12 is formed at each part of the substrate sheet 10 where each conductive bump 14 is formed by deforming the planar substrate sheet 10 at each part where each conductive bump 14 is formed. The conductive bump 14 is formed at each protrusion 12 on the surface of the substrate sheet 10 where a plurality of protrusions 12 are formed.;COPYRIGHT: (C)2009,JPO&INPIT