MANUFACTURING METHOD OF SUBSTRATE SHEET WITH CONDUCTIVE BUMP, MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD, AND SUBSTRATE SHEET WITH CONDUCTIVE BUMP

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate sheet with a conductive bump capable of shortening manufacturing time of a multilayer printed wiring board, a manufacturing method of the multilayer printed wiring board, and the substrate sheet with the conductive bump.;SOLUTION: First of all, a plurality of conductive bumps 14 are formed on one surface of a tabular substrate sheet 10. Then, on a viscoelastic sheet 22 having viscosity and elasticity, the substrate sheet 10 is mounted which has the conductive bumps 14 formed on the one surface thereof. Hereat, the conductive bumps 14 are placed in contact with the viscoelastic sheet 22. Then, the plurality of conductive bumps 14 are formed on another surface of the substrate sheet 10 mounted on the viscoelastic sheet 22.;COPYRIGHT: (C)2011,JPO&INPIT