首页> 外国专利> MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SURFACE LIGHT EMITTING SEMICONDUCTOR LASER, SURFACE LIGHT EMITTING SEMICONDUCTOR ELEMENT, OPTICAL TRANSMITTING/RECEIVING MODULE, AND OPTICAL COMMUNICATION SYSTEM

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SURFACE LIGHT EMITTING SEMICONDUCTOR LASER, SURFACE LIGHT EMITTING SEMICONDUCTOR ELEMENT, OPTICAL TRANSMITTING/RECEIVING MODULE, AND OPTICAL COMMUNICATION SYSTEM

机译:半导体器件的制造方法和表面光发射激光器,表面光发射半导体元件,光发射/接收模块以及光通信系统

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device, which can control pinching due to oxidation on the basis of reflectivity change even when an AlAs layer is comparatively thin.;SOLUTION: The method of manufacturing semiconductor device comprises the steps of radiating, in an oxidation furnace the light to an object to be measured including a layer to be oxidized in a semiconductor multilayer film structure in; detecting the reflected light from the object to be measured during the oxidation reaction; calculating a reflectivity of the reflected light, an average reflectivity, a variation rate of reflectivity, and a variation rate of the average reflectivity; and detecting progress of oxidation reaction based on the result of calculation in order to control the oxidation reaction. The object to be measured is a monitor sample on a semiconductor substrate and at least a part of the upper portion of the layer to be oxidized of the semiconductor multilayer film structure is removed by the etching process.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种制造半导体器件的方法,即使在AlAs层比较薄的情况下,该方法也可以基于反射率的变化来控制由于氧化引起的收缩。;解决方案:制造半导体器件的方法包括辐射步骤。 ,在氧化炉中,对要测量的物体的光包括在半导体多层膜结构中要被氧化的层;在氧化反应中检测来自待测物体的反射光;计算反射光的反射率,平均反射率,反射率的变化率和平均反射率的变化率;根据计算结果检测氧化反应的进程,以控制氧化反应。待测对象是半导体衬底上的监控样品,并且通过蚀刻工艺去除了半导体多层膜结构的待氧化层的上部的至少一部分。版权所有:(C)2004,JPO

著录项

  • 公开/公告号JP2004022686A

    专利类型

  • 公开/公告日2004-01-22

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20020173554

  • 发明设计人 UENISHI MORIMASA;

    申请日2002-06-14

  • 分类号H01S5/183;H01L21/66;H01S5/323;

  • 国家 JP

  • 入库时间 2022-08-21 23:31:33

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