PLATING DEVICE, CARTRIDGE AND COPPER DISSOLVING TANK USED THEREFOR, AND PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plating device for copper plating copper sources are easily exchanged.;SOLUTION: The plating device includes three copper dissolving tanks 110a-110c connected to a plating solution circulation passage to supply copper ions to the plating solution, a buffer tank 111 to supply substitution solution to any copper dissolving tanks 110a-110c which are not in use, and a substitution raw solution supply unit 112 to supply the raw substitution solution as an original substitution solution to the buffer tank 111. Copper meshes obtained by weaving copper wires, straight copper pipes, copper plates or the like are accommodated in the copper dissolving tanks 110a-110c. The copper dissolving tanks 110a-110c has an attachable/detachable cartridge, and the copper meshes or the like are disposed in the cartridge.;COPYRIGHT: (C)2004,JPO