首页> 外国专利> METHOD OF MOUNTING ELECTRONIC COMPONENT, METHOD OF CONNECTING PACKAGE, PACKAGE CONNECTING JIG, AND PUNCHING DEVICE FOR CONNECTING PACKAGE

METHOD OF MOUNTING ELECTRONIC COMPONENT, METHOD OF CONNECTING PACKAGE, PACKAGE CONNECTING JIG, AND PUNCHING DEVICE FOR CONNECTING PACKAGE

机译:电子组件的安装方法,连接方法,包装连接夹具和用于连接包装的打孔装置

摘要

PROBLEM TO BE SOLVED: To provide a package connecting jig that can improve the mounting efficiency of an electronic component.;SOLUTION: This package-connecting jig 8 is used for connecting ends of tape-like embossed tapes 5 each of which is provided with a tape body 51 on which a plurality of recesses 51A is formed continuously at prescribed pitches; a plurality of electronic components housed in the recesses 51A of the tape body 51, and a cover tape 53 which covers the recesses 51A housing the electronic components. At the end of the tape body 51 in the width direction, feed holes 51B are continuously formed at prescribed pitches along the arranging direction of the recesses 51A. The jig 8 is provided with a placing base 81 on which the tape body 51 is placed, wall members which are erected on the placing base 81 and with which the side edges of the embossed tape 5 in the width direction are brought into contact, and a plurality of pins 83 which are erected on opposite sides of the wall members 82 and inserted into the feed holes 51B of the tape body 51.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种能够提高电子部件的安装效率的封装连接夹具。解决方案:该封装连接夹具8用于连接带状压纹带5的端部,每个带状压纹带5均具有一个带体51,以规定的间距连续地形成有多个凹部51A。多个电子元件容纳在带主体51的凹部51A中,盖带53覆盖容纳电子元件的凹部51A。在带体51的宽度方向的端部,沿着凹部51A的排列方向以规定的间隔连续地形成有进给孔51B。夹具8具备:载置台81,其上载置带体51;立设在载置台81上的壁构件,使压纹带5的宽度方向的侧缘抵接。多个销钉83被竖立在壁构件82的相对侧上并插入到带体51的进给孔51B中。;版权:(C)2004,JPO

著录项

  • 公开/公告号JP2004055922A

    专利类型

  • 公开/公告日2004-02-19

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20020212980

  • 发明设计人 NUNOYAMA MITSURU;SUGITANI AKINORI;

    申请日2002-07-22

  • 分类号H05K13/02;B65B15/04;

  • 国家 JP

  • 入库时间 2022-08-21 23:30:17

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