The article discusses the possibility of electrically connecting two or more boards or modules used in electronics and microelectronics and the first results of reliability testing of a structure connected by SMD components. The test structures were cyclically exposed to thermal load in the temperature range −20°C to +100°C, with dwell time of 10 minutes at maximum and minimum temperature. Test samples are based on alumina and mounted with SMD components with package of size 0603. Test samples are soldered to boards with immersion gold surface finish. The aim of the experiment is to determine the lifetime of a structure connected by SMD components in respect to varying coefficient of thermal expansion of base materials.
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