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RESIN FOR PHOTORESIST, METHOD FOR PRODUCING THE SAME AND PHOTORESIST COMPOSITION

机译:光刻胶用树脂,其制备方法和光刻胶组合物

摘要

PROBLEM TO BE SOLVED: To provide a resin affording the production of a photoresist having excellent features such as resolution, sensitivity, heat resistance, a wide focus margin or a wide exposure margin in a lithographic applications using especially KrF excimer laser as a chemically amplified resist and to provide a photoresist composition.;SOLUTION: The resin for the photoresist is obtained by adding p-hydroxystyrene having a hydroxy group protected with a group leaving by actions of an acid to a part of an aromatic ring of a novolak type phenol resin prepared by reacting phenols with aldehydes in the presence of an acidic catalyst. The photoresist composition consists essentially of the resin for the photoresist, a compound generating the acid by actions of light and a solvent dissolving the resin for the photoresist and the compound generating the acid.;COPYRIGHT: (C)2004,JPO&NCIPI
机译:要解决的问题:提供一种树脂,该树脂可以生产光刻胶,该光刻胶在使用KrF准分子激光作为化学放大抗蚀剂的光刻应用中具有出色的分辨率,灵敏度,耐热性,宽焦点裕度或宽曝光裕度等特征;解决方案:用于光致抗蚀剂的树脂是通过向制备的酚醛清漆型酚醛树脂的一部分芳香环中加入具有被酸作用留下的被羟基保护的羟基的对羟基苯乙烯而获得的。在酸性催化剂的存在下使酚类与醛类反应。光致抗蚀剂组合物主要由用于光致抗蚀剂的树脂,通过光的作用产生酸的化合物和溶解用于光致抗蚀剂的树脂以及产生酸的化合物的溶剂组成。;版权所有:(C)2004,JPO&NCIPI

著录项

  • 公开/公告号JP2004250479A

    专利类型

  • 公开/公告日2004-09-09

    原文格式PDF

  • 申请/专利权人 SUMITOMO BAKELITE CO LTD;

    申请/专利号JP20030039669

  • 发明设计人 SAIMURA FUMITAKA;

    申请日2003-02-18

  • 分类号C08G8/28;G03F7/039;

  • 国家 JP

  • 入库时间 2022-08-21 23:30:16

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