The semiconductor device manufacturing method which uses the TDI detection device, the feedthrough equipment, the electronic beam device, and the said electronic beam device which utilize these

摘要

SolutionsTDI sensor 64 and feedthrough equipment 50 and, it possesses the electronic beam device. As for the feedthrough equipment, the pin 52 which is installed in the flange 51 which separates the environment which differs and pin it possesses with the socket contact 54 which connects with the other pin 53 which forms 52 and opposite, pin 52 and other pin 53 and socket contact 54 forms the terminal area, socket contact 54 has elastic body 61. Depending, making the terminal area many, connected power becomes small, can prevent sensor damage. TDI sensor 64 is connected by pin 53, the pixel arrangement, to aptitude is converted on the basis of the optical quality of mapping optical system. As for the said sensor, as range of vision of mapping projection optical system is made as much as possible small, it has the addition stage number which can take the largest allowance distortion inside the said range of vision largely. Furthermore at the same time data rate of the TDI sensor small it does not do and in order the number of pins as much as possible not to increase, addition stage number is decided. It is desirable, the number and addition stage number of lines are almost equal. Selective figure Figure 2