The strengthening heat radiator which removes heat from the integrated circuit device has the thermal conductivity core which possesses the upper part and the lower outer part surface territory. This device furthermore has the 1st array of the pin shape fin which extends to radial. Because heat it is connected to the upper part surface territory, the core and the flow of all directions occurs 1st array in the coolant which is introduced around 1st array in around those, heat dissipation from the integrated circuit device is promoted. As for 1st array and size of the core which includes the lower outer part surface territory, when installing the heat radiator on the integrated circuit device, in on the motherboard the component it is something which can be able to get near to the integrated circuit device sufficiently.
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