Development of new heat sink technology for high-density microprocessors.

摘要

This study investigates the performance of existing heat sinks and compares it with two heat-exchanger prototypes: aluminum-foam heat sink and PCM (phase-change material)-filled heat sink. Kapton flexible heaters are used to replicate the heat produced by a computer's CPU (central processing unit). A number of thermocouples are connected between the heater and the heat sink being used to measure the component's temperature. The thermocouples are also connected to a data acquisition card to collect the data using a LabVIEW program. The values obtained are compared to data published in literature to validate the experiments and the setup. This setup is then utilized to test the new heat exchangers and compare their performance to that of the existing heat sinks.