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Semiconductor devices and methods of fabricating silicon-on-sapphire wafer having an intrinsic silicon layer on a sapphire substrate
Semiconductor devices and methods of fabricating silicon-on-sapphire wafer having an intrinsic silicon layer on a sapphire substrate
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机译:半导体器件和制造在蓝宝石衬底上具有本征硅层的蓝宝石上硅晶片的方法
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摘要
A high-frequency wireless communication system on a single ultrathin silicon on sapphire chip is presented. This system incorporates analog, digital (logic and memory) and high radio frequency circuits on a single ultrathin silicon on sapphire chip. The devices are fabricated using conventional bulk silicon CMOS processing techniques. Advantages include single chip architecture, superior high frequency performance, low power consumption and cost effective fabrication.
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