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Flip chip in leaded molded package with two dies
Flip chip in leaded molded package with two dies
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机译:带两个芯片的引线模塑封装中的倒装芯片
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摘要
A chip device including two stacked dies. The chip device includes a leadframe that includes a plurality of leads. A first die is coupled to a first side of the leadframe with solder and a second die is coupled to a second side of the leadframe with solder. A molded body surrounds at least a portion of the leadframe and the dies.
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