首页>
外国专利>
Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method
Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method
展开▼
机译:金属芯基板印刷线路板,可实现热增强的球栅阵列(BGA)封装和方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A thermally enhanced face-up BGA substrate consists of a metal (copper) core, layers, dielectric layers, conductive through-core and build-up vias. It is a new and simple structure with better thermal performance, resulting in lower cost and better reliability. Moreover, high degree of flexibility in choice of material and layer counts as well as layer thickness allows for a wide range of applications in packaging and high density printed circuit board.
展开▼