Surface excited device package including a substrate having a vibration-permitted cavity

摘要

A surface excited device package and method for packaging a surface excited device provide a surface excited device having a small footprint, high reliability, low cost and high production volume. The surface excited device may be a Surface Acoustic Wave (SAW) device or a Micro Electromechanical System(MEMS) device. A substrate including multiple conductive patterns is bonded to a semiconductor die that includes a surface excited device area. The substrate includes multiple conductive patterns for connecting electrical connections of the die and terminals for connecting the surface excited device to external devices. The substrate further includes an aperture over the surface exited device area and a cover for covering the cavity formed by the aperture to protect the surface excited device area from the external environment.