Electronic component sucking device and electronic component testing apparatus having the same

摘要

Disclosed are an electronic component sucking device and an electronic component testing apparatus using the same, the sucking device comprising a suction head having at its extremity an opening arranged to suck an electronic component when a negative pressure is applied thereto; a hold-down center rod having an aperture, a conduit through which passes a gas supplied or discharged through the opening of the suction head, and a hold-down portion at its extremity adapted to be inserted into the interior of the suction head; a coil spring for imparting a biasing force to the suction head and the hold-down center rod; and a link lever interposed between the suction head and the hold-down center rod; wherein;when the hold-down center rod is subjected to a force pressing down against the biasing force of the coil spring, the link lever pushes the suction head upward so that the hold-down portion of the hold-down center rod protrudes from the suction head.